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Interesting EAGLE V8 Seminar now in Belgium
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Cross Sections – What is their Purpose ?
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during office hours. We will be more than happy to help.
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Tips and Tricks – Solder paste editor
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We don’t want to say goodbye!
For many years Eurocircuits have provided you with important News & Information about our services, products, free to use smart tools and the Electronic Manufacturing World.
We will continue to do so and would like to include you in this. If you agree – Login to your account and click “ALL”.
Your consent is necessary for us to comply with the new General Data Protection Regulation (GDPR) which will come in to effective from 25th May 2018. If you would like to know how Eurocircuits manages this topic, we have made an information page to explain in detail our policy.
If you would like to customize the subjects on which you would (or would not) like to receive News & Information about. Please go to your Eurocircuits customer profile and change your News & Information preferences.
Kind regards,
The Eurocircuits team
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Soldermask for Via Holes and Pads
Recently, Eurocircuits introduced a spray coating process for Soldermask, this brings many advantages including a thinner and more unified coating which helps us to meet today’s technology challenges.
The Soldermask is imaged using aDai Nippon Ledia Direct Imaging system; this improves registration accuracy and eliminates the need for Photo-tools.
The spray coating of Soldermask is only achievable due to the low viscosity of the ink. Due to this low viscosity however, there may also be Soldermask ink in the barrel of the Via Hole. This may or may not remain after final curing depending upon the data provided by the customer.
The Soldermask data we receive for Via’s (holes and pads) varies from customer to customer, the Via’s may have no Soldermask Opening, meaning they are to be completely covered with Soldermask, also known as Tented Via’s.
Fully Tented Via Holes cannot be guaranteed with spray coating due to the viscosity of the ink. There may be a small opening in the Soldermask above the Via Hole and there may be Soldermask residue in the barrel after curing. To avoid this we strongly recommend using our Via Filling option when ordering PCB’s with Tented Via’s.
If the data shows untended Via Holes or Pads we follow our standard design rules, as below:
Minimum Soldermask Opening of 0.4mm
or
Actual drill size (TOOLSIZE) +0.15mm
Whichever is the larger
Additionally, we ensure that our other design rules for Soldermask are also met, as below:
- MAR(Mask Annular Ring) – the clearance between the Soldermask and the copper pad.
- MSM(Mask SegMent) – the bridge of Soldermask between adjacent pads.
- MOC(Mask Overlap Clearance) – Soldermask coverage between a track or plane and an adjacent Soldermask Opening.
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Please also see our:
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EUROCIRCUITS EN GDPR – BLIJF BIJ ONS !
Reeds vele jaren stuurt Eurocircuits u belangrijk nieuws en informatie omtrent haar diensten, producten, gratis te gebruiken programma’s en omtrent onze gemeenschappelijke wereld van elektronicafabricage.
We willen dit met veel ijver en plezier voor u blijven doen. Bent u het met ons eens?- Meldt u dan aan en klik “ALL”.
Gezien het in voege treden van de “General Data Protection Regulation (GDPR)” is het van belang dat wij uw toestemming ontvangen. Wilt u weten hoe wij precies met GDPR omgaan en welke informatie wij u wensen te sturen? Bezoek dan deze informatie pagina. We leggen er uit wat we doen en welke informatie wij voor u hebben.
Wilt u slechts een deel uit de informatie die wij ter beschikking hebben, ontvangen? Dat kan. Ga naar deze informatiepagina over uw Eurocircuits klantprofiel en zoek uit wat uw interesse wegdraagt. Meldt u vervolgens aan en stel uw keuze in.
Met vriendelijke groeten,
Het Eurocircuits team
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NON VOGLIAMO DIRVI ADDIO
Per parecchi anni Eurocircuits vi ha fornito importanti novita’ ed informazioni sui propri servizi, prodotti, utili tools gratuiti e sul mondo della manifattura elettronica.
Vorremmo continuare a farlo e vorremmo includervi in questo. Se Siete d’accordo – Accedete al vostro account e cliccate “ALL”
Il vostro consenso e’ necessario per conformarsi al nuovo Regolamento sulla Protezione dei Dati Personali (GDPR) che entrera’ in vigore dal 25 Maggio 2018. Se volete conoscere come Eurocircuits gestisce questo argomento, abbiamo preparato una pagina informativa per spiegare in dettaglio la nostra politica al riguardo.
Se lo desiderate potete personalizzare gli argomenti su cui desiderate (o non desiderate) ricevere aggiornamenti. Per farlo entrate nel vostro profilo cliente Eurocircuits e cambiate le singole preferenze sulle novita & informazioni.
Cordiali saluti
Dal team Eurocircuits
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Nous ne voulons pas vous dire au revoir !
Depuis de nombreuses années Eurocircuits vous communique des informations importantes sur ses Services, ses Produits, la libre utilisation de ses puissants outils en ligne et sur le monde de la production électronique.
Nous continuerons à le faire et nous souhaitons vous inclure dans cette démarche. Si vous y adhérez veuillez-vous connecter à votre compte et procéder en suivant.
Votre consentement est nécessaire afin que nous soyons en conformité avec la nouvelle règlementation sur la protection des données « GDPR » qui entrera en vigueur le 25 mai 2018.
Pour en savoir plus Eurocircuits a créé cette page d’informations détaillant sa gestion de mise en conformité.
Vous pouvez également personnaliser la communication en sélectionnant les rubriques pour lesquels vous souhaitez recevoir les informations.
Cordialement,
L’équipe Eurocircuits
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No queremos despedirnos!
Durante muchos años, Eurocircuits le ha proporcionado importantes noticias e información sobre nuestros servicios, productos, herramientas inteligentes de uso gratuito y el mundo de la fabricación electrónica.
Continuaremos haciéndolo y nos gustaría incluirlo en esto. Si acepta, inicie sesión en su cuenta y haga clic en “ALL”.
Su consentimiento es necesario para que cumplamos con el nuevo Reglamento General de Protección de Datos (GDPR) que entrará en vigencia a partir del 25 de mayo de 2018. Si desea saber cómo Eurocircuitos maneja este tema, hemos creado una página de información para explicar en detallar nuestra política
Si desea personalizar los temas sobre los cuales le gustaría (o no) recibir noticias e información. Vaya a su perfil de cliente de Eurocircuits y cambie sus preferencias de Noticias e información.
Saludos cordiales,
El equipo de Eurocircuits
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Não queremos despedir-nos!
Há muitos anos que a Eurocircuits fornece notícias e informações importantes sobre nossos serviços, produtos, ferramentas inteligentes para uso gratuito e o mundo da eletronica.
Continuaremos fazê-lo e gostaríamos de incluí-lo. Se aceitar, faça o login na sua conta e clique em “ALL”.
O seu consentimento é necessário para cumprirmos o novo Regulamento Geral de Proteção de Dados (GDPR), que entrará em vigor a partir de 25 de maio de 2018. Se gostaria de saber como a Eurocircuits gere este tópico, fizemos uma página de informações para explicar em detalhe a nossa política.
Se deseja personalizar os assuntos sobre os quais gostaria ou não de receber notícias e informações. Por favor, vá ao seu perfil de cliente da Eurocircuits e altere suas preferências de Notícias e Informações.
Atenciosamente,
Equipa da Eurocircuits
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Nem akarunk búcsút venni!
Cégünk évek óta tájékoztatja partnereit fontos információkról, szolgáltatásairól, forgalmazott berendezéseikről.
Továbbra is szeretnénk ezt folytatni. Ha egyetért, jelentkezzen be fiókjába és kattintson ALL IN gombra.
Az új általános adatvédelmi rendeletnek megfelelően – mely 2018. május 25-től lép életbe –ehhez az Ön beleegyezése szükséges.
Ha szeretné tudni, hogy az Eurocircuits hogyan kezeli ezt a témát, készítettünk egy információs oldalt ennek magyarázatához.
Testre szabhatja a kívánt – illetve nem kívánt – információkat, melyhez a Profil Beállítások menüpontban férhet hozzá a Hírek & Információk fül alatt.
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SEMI-FLEX pool
What is SEMI-FLEX?
SEMI-FLEX is a flex-rigid PCB, typically 4 layers, made entirely of FR4. Unlike conventional flex-rigid PCBs, the flexing element is not polyimide but a thin FR4 core with two layers of copper specially treated to flex without cracking. A less robust solution uses a depth-milled layer rather than a core.
Why use SEMI-FLEX?
SEMI-FLEX is flex-to-install. Unlike polyimide, the FR4 core is not capable of continuous flexing. However it will bend a limited number of times (typically 5 – see the technical specification below) at a controlled radius and to any angle. This makes it an ideal solution where you need to mount two PCBs in a unit at an angle to each other. Instead of using connectors and cables or a composite flex-rigid PCB, you can design a single FR4 SEMI-FLEX PCB which can be safely bent a sufficient number of times to allow installation and subsequent maintenance as needed.
The benefits of using SEMI-FLEX are:
COST:
- No need for connectors or cables
- Less time needed for assembly
- SEMI-FLEX is entirely FR4, so no need for boards made with expensive polyimide
Product reliability:
- Fewer solder-joints
Time:
- Faster design time
- Faster procurement
- Faster build
Eurocircuits SEMI-FLEX pool
Eurocircuits’ 4-layer SEMI-FLEX PCBs use a 100 micron central core for the flex area, with 35 micron high-ductility copper foil on each side. The stack is then made up on each side with a 510 micron FR4 core and two layers of no-flow pre-preg (see the full technical specification below). An alternative technology is to build a 2- or 4-layer PCB and then depth-mill the material away to leave a thin section as the flex area. We have adopted the core solution even though it needs more operations and so is a little more expensive. It gives a symmetrical build and so a more stable board, while depth-milling is difficult to control meaning that the flex area may have an irregular thickness. With a core-build we through-mill (rout) the pre-preg before pressing. We can then rout the outer layers with any minor variation in cutter depth being absorbed by the void.
The core build makes it easier to design a main board with up and down sections or a final Z-configuration.
SEMI-FLEX boards are preferably supplied in a panel to avoid any damage during transport or assembly.
| SEMI-FLEX technical specification | |
|
SEMI-FLEX area |
|
|
Minimum bend radius |
5 mm |
|
Maximum bend angle |
180° |
|
Maximum number of bends |
5 |
|
SEMI-FLEX length calculator |
(2 x pi x bend radius) x (bend angle/360) For example, bending 5 times over an angle of 180 degree with a radius of 5mm requires a minimum length of the semi-flex part of 15,7mm
|
|
Copper thickness on semi-flex core |
35µm high ductility copper |
|
Highest pattern class |
6 – 150µm track/gap (to accommodate the bending) |
|
Drill holes |
Not allowed  |
|
Slots and cut-outs |
Not allowed |
|
Corners in semi-flex area profile |
Minimum radius 1.00 mm  |
|
Corner where a narrow semi-flex area joins rigid area |
Minimum radius 1.00 mm |
|
Recommended |
Use copper on both sides |
|
Recommended |
Use copper pour around tracks where possible |
|
RIGID area |
|
|
Required |
Yes – At each end of the Semi-Flex Material |
|
Minimum size |
Width of Semi-Flex Material or 5mm x 5mm whichever greater |
|
Material (rigid and semi-flex cores) |
Isola PR370HR |
|
Number of copper layers |
4 |
|
Board thickness |
1.6 mm (see build map) |
|
Semi-flex core thickness |
100µm |
|
Outer layer start copper foil |
18 µm |
|
Highest pattern class |
7 – 125µm track/gap |
|
Surface finish |
Che Ni/Au selective (ENIG) |
|
Soldermask |
Green |
|
Legend |
As STANDARD pool |
|
Profile |
Break-routing or scoring |
|
Slots and cut-outs (milling) |
As STANDARD pool – in rigid area only |
|
Advanced technologies allowed |
Peel-off mask, PTH on board edge, round edge plating, copper up to board edge. Plus carbon pads and edge connector gold as non-pooling options. |
|
Advanced technologies not allowed |
Blind & Buried vias |
|
UL marking |
Not yet available |
|
Delivery format |
Preferably delivered in a panel for safe handling |
Explore all PCB Pooling services from Eurocircuits
NAKED proto
Fast proof-of-concept board, No soldermask and no silkscreen
PCB proto
1, 2 or 5 PCBs in 2, 3, 5 or 7 working days
STANDARD pool
FR-4 lead-free soldering compatible material up to 16 layers
BINDI pool
Medium volume boards from our new plant in India
RF pool
Isola I-TERA and Rogers 4000 series material
SEMI-FLEX pool
4 layer, 100 micron FR4 core with two specially treated copper layers
IMSpool
Single layer Insulated Metal Substrate PCBs (ALU)
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Cross Sections – What is their Purpose ?
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Innovation & Networking Night 1.0
Dinsdag, 5 juni 2018, eerste “Innovation & Networking Night 1.0” – Eurocircuits was erbij.
We troffen er enkele van de studententeams die Eurocircuits steunt. We konden daar niet alleen kijken naar de wagen van Formula Electric Belgium en de Punch Powertrain zonnewagen, maar ook naar een aantal andere studententeams die verschillende wetenschappelijke innovaties tentoonstelden. Dit vond plaats in het imposante KBC hoofdkantoor in Leuven.
De avond ging van start met een korte reeks presentaties van de verschillende deelnemende teams en de sponsoren die zonder uitzondering vol lof spraken over de deelnemende teams. Daarna volgde een aantal interactieve sessies met de betrokken teams die elk een deel van de bezoekers deel probeerden te maken van de ideeen en de problemen die ze in hun projecten ondervonden. Daarna was er tijd voor een borrel waar de deelnemers en de bezoekers onder het genot van een aantal (uitstekende) hapjes en drankjes op ontspannen wijze met de teams en elkaar konden socialiseren. We zijn er op dat moment bij Eurocircuits van overtuigd geraakt dat het een waardevolle investering is geweest om voor deze teams een sponsoringsovereenkomst aan te gaan.
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Delft Aerospace Rocket Engineering of TU Delft – Make Stratos III Fly!
July 16th 2018 – D-day to make Stratos III fly high!
DARE, a student rocketry society from TU Delft, is currently in the final stages of developing their next boundary breaking rocket Stratos III.
The team will launch their 8-meter-tall rocket on the 16th of July attempting to break the European altitude record for students. This record is currently set at 32 km by student team HyEnD from Stuttgart.
If you would like to help DARE break the record you can make a contribution to the Stratos crowdfunding campaign “Make Stratos Fly!”. The team is collecting money necessary to have multiple launch attempts as the possibility of launching is highly dependent on the weather and every attempt requires refilling the propulsion system.
The more attempts they can afford, the bigger the chances for breaking the altitude record. You can read more about their campaign here.
Let’s make Stratos III fly high, higher than any before! Eurocircuits PCBs into space.
Project Stratos
Delft Aerospace Rocket Engineering (DARE) is one of the most advanced student rocketry groups in the world. We are a group of ambitious students sharing an intense passion for rocket design. We build and launch rockets that serve scientific and educational purposes. Our members challenge each other by self-initiated projects. In DARE, people get the opportunity to obtain a kind of hands-on experience which is unique in the world.
The flagship project of DARE is Project Stratos. The goal is to continuously push the boundaries of student rocketry. We are striving to be the first student organization to reach space. The Stratos II+ broke the European altitude record in October 2015, by launching it to 21.5km altitude. The launch livestream was watched by more than 150.000 unique viewers. Besides this, the launch was big news on all national media, and made it to several international media like Der Spiegel Online and Business Insider.
In the meantime, the record has been broken by HyEnD from Stuttgart. We are eager to get the record back in Dutch hands again, which has resulted in the development in Stratos III. The concept of the rocket is similar as Stratos II, but it is scaled up significantly. Next to this, it uses several more advanced technologies, including a 4.5 meter composite oxidizer tank, a new hybrid rocket engine and an advanced parachute deployment mechanism. Stratos III will launch in July 2018, aiming for the new altitude record.
We are currently in the final stages of preparing for the launch and on 28thof May we presented the Stratos III rocket to the world. The next step is to perform final dress rehearsals which means our team will practice the launch procedures to ensure a smooth operation when the rocket is actually being launched. Then, all the components will be shipped to Spain and the launch crew will travel to the launch site. There, we will assemble the rocket and set up everything for the launch. After two weeks of preparations, we will attempt to launch on 16thof July. It could be that the launch will be postponed due to, for example, strong sidewinds. We can then postpone the launch to another day. The final possible attempt will be on the 27th.
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The Optimum PCB Design Flow – Right First Time
Bring your product to market on time and within budget – join the Eurocircuits Community
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The Layer Editor 2018
Since the introduction of the PCB Visualizer we have added a number of specialised editors. The latest of these is the Layer Editor, it offers a range of editing tools enabling you to modify, add or delete features as necessary.
Recently, we add the compare function, this allows you to compare any modifications you made to a layer with the original uploaded data, giving you the confidence that the changes were correct.
The tools available apply to features and layers where applicable and include:
– Insert – Add Layers
– Copy – Paste
– Delete – Mirror
– Offset – Measure
– Undo/redo – Compare
The Layer Editor is designed to save you time, use tools available to correct data output or even design issues.
For example, if the bottom side Soldermask was not defined in the CAD system, you are able to create it using the Layer Editor in these easy steps below:
- Create a new layer called Bottom Soldermask.
- Selects all the relevant pads from the bottom side copper layer.
- Copy these to the clipboard.
- Paste them to the newly created bottom Soldermask layer.
- Select the pasted pads and increase the size as necessary fro the Soldermask Openings.
Now you have created the Bottom side Soldermask layer without having to modify or create new data in you CAD system.
Another great feature is the Outline view, this allows you to see the data unfilled, it’s a great tool to see how your data was generate by your CAD system and allows you to see potential errors.
Normal View
Outline View
The Layer Editor is a key addition to our PCB Visualizer and the next step in our drive towards Right 1st Time data for manufacturing.
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Studenten TU Delft onthullen nieuwste Hyperloop voor snelheidscompetitie
Het TU Delft studententeam Delft Hyperloop heeft 19 juni 2018 de nieuwe Hyperloop gepresenteerd waarmee zij meedoen aan het derde deel van de Hyperloop Pod Competitie van SpaceX.
Doel van het team is om op 22 juli 2018 niet alleen deze fase van de competitie te winnen, maar ook het Hyperloop wereldsnelheidsrecord te verbreken.
Het studententeam heeft ten overstaan van 1100 aanwezigen en een wereldwijd publiek via een livestream onthuld wat de Delft Hyperloop zo snel maakt en waarom zij overtuigd zijn dat hiermee het derde deel van de Hyperloop Pod Competitie van SpaceX gewonnen kan worden.
De Delft Hyperloop bestaat uit twee onderdelen: de launcher en de passagiersmodule. Het team van 37 studenten is van plan met de launcher het Hyperloop wereldsnelheidsrecord van 384 km/u te breken.
De onderdelen van dit snelheidsmonster zijn volledig geoptimaliseerd. “Het draait allemaal om de power-to-weight ratio. We hebben gevochten voor elke gram”, aldus Hyperloop-teamleider Edouard Schneiders.
De combinatie van een sterke motor met het lichtgewicht voertuig moet de winnende combinatie worden. De energiebron bestaat uit LiPo batterijen, met een hoge power-to-weight ratio, beschermd door een luchtdichte batterijdoos. Het geheim van de voortstuwing is een groot wiel, geklemd op de hyperloop baan voor zo veel mogelijk grip. Dit is efficienter voor hoge snelheden op kleine afstanden. De pneumatische remmen zijn voorzien van een fail-safe systeem. De passagiersmodule kan geplaatst worden op de launcher om passagiers en vracht te vervoeren op hoge snelheden. Deze specificaties zijn tijdens de presentatie voor het eerst aan de wereld getoond. De Delftse studenten hebben de onderdelen van de hyperloop al in Nederland getest, zodat ze tijdens de competitie bij SpaceX niet voor verrassingen komen te staan. Ze hebben de wedstrijd-run kunnen simuleren dankzij software van hoofdsponsor Cognizant, waarmee nauwkeurig berekend kon worden hoe de hyperloop zich zal gedragen in de vacuumbuis op hoge snelheden.
Wereldwijd zijn twintig universiteiten gekwalificeerd om aan het derde deel van de Hyperloop Pod Competitie deel te nemen. TU Delft is daar een van en heeft vandaag niet alleen hun voertuig, maar ook hun toekomstvisie op de Hyperloop gepresenteerd. Naast het studententeam, hebben Mark Bello, CEO van Jacobs, en Manoj Matthew van hoofdsponsor Cognizant tijdens de presentatie de mogelijkheden en het belang van de Hyperloop voor de toekomst onderstreept. Reizen met een functionele Hyperloop zal voor passagiers om en nabij even duur zijn als vliegen, maar een Hyperloop zal viermaal minder energie kosten dan vliegverkeer en is in veel gevallen sneller. Hyperlooptunnels kunnen in de toekomst niet alleen voor transport worden gebruikt, maar ook voor opslag van regenwater en de aanleg van data- en elektriciteitskabels.
Hyperloop
De Hyperloop moet het vervoermiddel van de toekomst worden, het vijfde toonaangevende vervoersmiddel naast auto, trein, vliegtuig en boot. Door elektromotoren aangedreven pods worden op hoge snelheid door een vacuüm buis geschoten, wat op hoge snelheid reizen over lange afstanden mogelijk moet maken. Een volledig functionele Hyperloop kan na 70 kilometer accelereren topsnelheden boven de 1000 kilometer per uur halen. Ter illustratie, de Hyperloop brengt de reistijd van Amsterdam naar Parijs terug tot zo’n 30 minuten.
SpaceX en Delft Hyperloop
SpaceX, een onderneming van Tesla’s Elon Musk, heeft de Hyperloop Pod Competitie in 2015 gestart, met als doel om voortgang van de Hyperloop-ontwikkeling te accelereren. Studententeam Delft Hyperloop van TU Delft won in 2017 het eerste deel van de competitie, met een ontwerp op het gebied van schaalbaarheid van publiek- en goederenvervoer. Het team scoorde destijds met de efficiëntie, betrouwbaarheid en veiligheid van hun ontwerp. De ambities voor de derde fase van de competitie liggen hoog. In de voor de Hyperloop Pod Competitie gebouwde wedstrijdbuis van anderhalve kilometer, staat het wereldrecord nu op 384 kilometer per uur. Delft Hyperloop wil het snelheidsrecord op dat specifieke traject gaan breken.
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Belgrade Formula Student Team “Road Arrow” believes in their chances.
To have a fast and reliable race car means to have fast and reliable electronics. This is the reason that one of the primary goals of Formula Student Team “Road Arrow” from the University of Belgrade set at the beginning of season 2017/2018, was a complete overhaul of all electronic systems of the vehicle. This required detailed planned wiring, effectively programmed microcontrollers and reliable PCBs that would support our data acquision and processing as well as control of the vehicle. This is where Eurocircuits came in and agreed to build all of the necessary PCBs we had designed.
Needless to say that Road Arrow would not be the same without the help of Eurocircuits. Almost every electronic subsystem has its own PCB. These are:
- Main relay board: Until this year main relays and fuses were placed in a box with no proper space management. This year we have designed a special PCB on which all relays will be mounted. This elegant solution significantly reduced required space for relays and fuses and simplified maintenance and eventual replacement of parts. Special caution was taken in designing due to large currents that heat up the board.
- Shifter board: An important part of transmission switch system which processes the signals from the shifters in the cockpit to the gear shift mechanism in the powertrain.
- Main Unit board: Along with the Electronic Control Unit represents the brain of the vehicle. This is the reason that this board was the most complex of all to design. The board has mountings for GPS, GSM, Gyroscope, TRF and SD Card modules. A STM-F746ZI Nucleo microcontroller is used to coordinate all of the information that flows through the board, which includes reception of information from the modules, their processing, further sending to other units and storage for later analysis.
- Analogue sensor unit board: Because of system decentralization we needed two boards both with the same task: Acquisitionof analogue data from sensors, ADC conversion and further flow via CAN. This is done using a STM8a MCU.
- Dashboard electronics board: This year we have devoted special attention to our drivers real time information feed about vehicle condition during race. For this reason we have installed a LCD display (STM32 F469NI-Discovery board). Critical information such as speed, rpm, temperature and pressure readings etc. are received via CAN and displayed on several slides which are manuallychangeable by a special button fitted on the steering wheel. Display graphics are programmed from scratch in a way that the driver with a single glance can obtain information about the vehicle in motion without losing focus on the driving itself. Because of the importance of RPM to the driver, it is displayed by a set of diodes in a bar style display. A PCB board is used for mounting the display and diodes as well to communicate between the display and the rest of the system.
As we said before, careful cable management is a crucial part of every serious vehicle. Since last year we have implemented an effective way of wiring the vehicle: instead of laying wire by wire in the chassis we used a method used by big automotive and aerospace companies and assembled the whole wiring system on a table and laid it at once in the chassis. This year we have even more improved our wiring harness and in advance created a wiring part in our CATIA model of the vehicle which gave us precise information of length and position of every cable in the car. We used automotive standards in all electronics subsystems. Internal communication between microcontrollers are not an exception. A standardized CAN protocol is enabling a huge data flow capacity and therefore fast information update. Standardized cable coloring and marking and automotive connectors were used as well.
The GSM module mentioned before is used to maintain live communication connection between the driver and the team at pitstop. A custom built desktop application is used to display all the information gathered from sensor units and ECU, which are mostly the same information that the display has. A TRF module is used to send the info to the computer. This enables the crew to easily coordinate with the driver and warn him about potencial faults by reading telemetry data.
Building a reliable and sophisticated electronics system required serious tools so an effort has been made on upgrading electronics laboratory equipment in the team workshop.
PCBs designed by our members from the subteam for Electronics and built by Eurocircuits are a proof that students, most of them still on bachelor studies can undertake a complex task of building a race car with appropriate support from manufacturing companies. Even though we have successfuly tested the PCBs in the laboratory the real tests are yet to come when the car rolls up on Riccardo Palleti and Autodromo Most racing circuits this summer. We look forward to continue our work with Eurocircuits, especially due to the fact the team plans on switching its production from combustion engine to an Electro powered vehicle for the seasons ahead, were PCB designing skills are much more demanding.
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Layer Editor – another free to use eC Smart Tool
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